![[Grinding/Processing Method Introduction] Lapping Process (Double-Sided Grinding)](https://image.mono.ipros.com/public/product/image/7b9/2000717380/IPROS31978723393873754772.png?w=280&h=280)
[Grinding/Processing Method Introduction] Lapping Process (Double-Sided Grinding)
No subsequent peeling process! Introducing grinding processing that leads to reduced lead time and cost savings.
"Wrapping processing (double-sided polishing)" performs high-precision polishing of various ceramics for electronic components, single crystal materials, optical glass, quartz, and other materials. We own models ranging from 4B to 9B and have a rich variety of polishing carriers, allowing us to respond flexibly based on processing quantities. Additionally, we can adjust surface roughness according to the type and grit of the polishing material. You can consult with us regarding processing methods tailored to your specifications and materials. 【Features】 ■ No adhesive or peeling processes involved ■ Leads to reduced lead times and cost savings ■ Models range from 4B to 9B, with a wide selection of polishing carriers available ■ Surface roughness can be adjusted based on the type and grit of the polishing material ■ Processing methods can be discussed to match customer specifications and materials *For more details, please refer to the PDF document or feel free to contact us.
- Company：シンコー
- Price：Other
